| 1. | Tqfp thin plastic quad flat pack
薄型方面平面封装 |
| 2. | Quad flat pack qfp
方扁形封装体 |
| 3. | Adaptor - carrier quad flat pack to pin grid array sockets for use in electronic equipment , detail specification for
电子设备用插针格栅阵列插座的载体方形扁平组件的适配器用详细规范 |
| 4. | Adapter - carrier quad flat pack to pin grid array sockets for use in electronic equipment , blank detail specification for
电子设备用插针格栅阵列插座的载体方形扁平组件的适配器用空白详细规范 |
| 5. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of quad flat packs
半导体装置的机械标准化.表面固定半导体装置包装外廓线绘制一般规则.包装尺寸测量方法 |
| 6. | Mechanical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; measuring methods for package dimensions of quad flat packs
半导体器件的机械标准化.第6 - 3部分:表面安装半导体器件封装外形图绘制的一般规则.四面扁平部件封装尺寸的测量方法 |
| 7. | Mechnical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of quad flat packs
半导体器件的机械标准化.第6 - 3部分:半导体器件包装用表面安装略图制备的一般规则.四方块包装件包装尺寸的测量方法 |
| 8. | The transistor count is 3 . 8 million ; the package is surface mount 240 - pin quad flat pack ( qfp240 ) ; and the die size is 98mm2 ; the most advanced research progress on microprocessor architecture is extensively studied to get technical preparations for microprocessor design
该处理器目前正在进行后端设计，即将采用0 . 25 mcmos工艺流片，整个处理器的晶体管数目为380万，封装形式是qfp240 ， die面积为98mm ~ 2 。 |
